Fabrication and Dielectric Properties of Soft-core Helical Particles Using Spirulina Platensis as Templates
Aiming at the lightweight filler particles with good dielectric properties in the composites, helical Spirulina platensis were chosen as templates to produce microscopic helical soft-core filler particles by an electroless deposition technique. The morphology and appearance of the coated Spirulina platensis was analysed with optical microscopy and scanning electron microscopy respectively, the result showed that the particles were successfully coated with a uniform metal coating and their initial helical shape were perfectly replicated. The dielectric properties of these helical soft-core filler particles embedded in epoxy resin were studied in detail, which showed that with the coating thickness increase, the real and imaginary part of permittivity of the composites both increase in a frequency of 2–18 GHz. These soft-core metallised helical microorganisms are lightweight and have good dielectric properties. The metal content in the composites is only 6.6 vol% when the percolation threshold occurs. Such low metal content can reach percolation point is attributed to the filler particles’ soft-core structure and long helical shape advantage. Keywords: Microorganism; bio-replicated forming; soft-core helical particle; electroless deposition; dielectric property
Microorganism; bio-replicated forming; soft-core helical particle; electroless deposition; dielectric property
- There are currently no refbacks.
How to do online submission to another Journal?
If you have already registered in Journal A, then how can you submit another article to Journal B? It takes two steps to make it happen:
1. Register yourself in Journal B as an Author
Find the journal you want to submit to in CATEGORIES, click on “VIEW JOURNAL”, “Online Submissions”, “GO TO LOGIN” and “Edit My Profile”. Check “Author” on the “Edit Profile” page, then “Save”.
Go to “User Home”, and click on “Author” under the name of Journal B. You may start a New Submission by clicking on “CLICK HERE”.
We only use the following emails to deal with issues about paper acceptance, payment and submission of electronic versions of our journals to databases:
firstname.lastname@example.org; email@example.com; firstname.lastname@example.org
Copyright © Canadian Research & Development Centre of Sciences and Cultures (CRDCSC)
Address:730, 77e AV, Laval, Quebec, H7V 4A8, Canada
Telephone: 1-514-558 6138